EIP-24: Remove Bonding
Background
This EIP marks the second of three in preparation for the ESDv2 upgrade.
We aim to take an iterative upgrade approach to this migration in order to lessen the likelihood of errors during the process.
Overview
The next step in the migration process will be to remove the bonding system from the DAO to reduce overall mechanism complexity heading into the migration-only state.
Bonding Removal
This change removes the ability to bond and unbond ESD
going forward, temporarily locking ESDS
balances. All ESD
held in the DAO will then be burned on commit, since it would be no-longer redeemable.
Methods removed
deposit()
bond()
unbond()
unbondUnderlying()
Note withdraw()
will remain indefinitely.
Effect on v1 ESDS
(bonded ESD
)
- v1
ESDS
will no longer be redeemable for v1ESD
, and will therefore be locked until EIP-25 passes, and migration to v2ESDS
is enabled. - v1
ESDS
will migrate1:1
to v2ESDS
.
Effect on v1 ESD
- v1
ESD
will continue to be freely transferrable indefinitely, and will become migrate-able to v2ESDS
once EIP-25 is passed. - v1
ESD
will convert to v2ESDS
at the same rate as v1ESDS
as of EIP-23 when this rate was frozen. (This means there is no economic advantage to upgrading to v2ESDS
viaESD
vsESDS
).